DocumentCode :
2888498
Title :
A sustainable data center with heat-activated cooling
Author :
Haywood, Anna ; Sherbeck, Jon ; Phelan, Patrick ; Varsamopoulos, Georgios ; Gupta, Sandeep K S
Author_Institution :
Sch. of Comput., Inf., & Decision Syst. Eng. Comput. Sci. & Eng., Arizona State Univ., Tempe, AZ, USA
fYear :
2010
fDate :
2-5 June 2010
Firstpage :
1
Lastpage :
7
Abstract :
Technological and economic trends in data centers push toward facilities operated at higher ambient temperatures and at higher power densities to meet ever-increasing computational demands. Conventionally, data centers are cooled with vapor-compressor equipment which requires extra power to be driven. This paper proposes an alternative and sustainable data center cooling architecture that is heat driven. The thermal source is the heat produced by the data center room´s equipment. A major challenge is providing both enough cooling to the data center and enough exergy to drive the cooling process, regardless of the thermal output of the data center equipment. This challenge is addressed by the use of organic heat storage and a sustainably powered (i.e. solar-powered) heat source, leading potentially to a PUE (Power Usage Effectiveness) value of less than one.
Keywords :
air conditioning; compressors; cooling; thermal energy storage; absorption chiller; heat-activated cooling; organic heat storage; power usage effectiveness; sustainable data center; thermal source; vapor-compressor equipment; Aerospace materials; Cooling; Data engineering; Data flow computing; Energy storage; Heat pumps; High performance computing; Poles and towers; Space heating; Thermal loading; CRAC; PUE; absorption chiller; blade server; chassis; data center; green computing; rack; sustainability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1087-9870
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2010.5501334
Filename :
5501334
Link To Document :
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