• DocumentCode
    2888498
  • Title

    A sustainable data center with heat-activated cooling

  • Author

    Haywood, Anna ; Sherbeck, Jon ; Phelan, Patrick ; Varsamopoulos, Georgios ; Gupta, Sandeep K S

  • Author_Institution
    Sch. of Comput., Inf., & Decision Syst. Eng. Comput. Sci. & Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Technological and economic trends in data centers push toward facilities operated at higher ambient temperatures and at higher power densities to meet ever-increasing computational demands. Conventionally, data centers are cooled with vapor-compressor equipment which requires extra power to be driven. This paper proposes an alternative and sustainable data center cooling architecture that is heat driven. The thermal source is the heat produced by the data center room´s equipment. A major challenge is providing both enough cooling to the data center and enough exergy to drive the cooling process, regardless of the thermal output of the data center equipment. This challenge is addressed by the use of organic heat storage and a sustainably powered (i.e. solar-powered) heat source, leading potentially to a PUE (Power Usage Effectiveness) value of less than one.
  • Keywords
    air conditioning; compressors; cooling; thermal energy storage; absorption chiller; heat-activated cooling; organic heat storage; power usage effectiveness; sustainable data center; thermal source; vapor-compressor equipment; Aerospace materials; Cooling; Data engineering; Data flow computing; Energy storage; Heat pumps; High performance computing; Poles and towers; Space heating; Thermal loading; CRAC; PUE; absorption chiller; blade server; chassis; data center; green computing; rack; sustainability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501334
  • Filename
    5501334