• DocumentCode
    2888627
  • Title

    Table of contents

  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    25
  • Abstract
    The following topics are dealt with: thermal interface materials; device level thermal management and LED cooling; single phase liquid cooling; data center cooling and phase change materials; two phase liquid cooling; thermoelectronics and refrigeration; heat pipes; heat conduction; transient heat transfer; chip cooling and stacked dies; reliability; microfluidics; and nano-enhanced thermal management.
  • Keywords
    cooling; heat conduction; heat pipes; light emitting diodes; microfluidics; nanotechnology; semiconductor device reliability; thermal management (packaging); LED cooling; chip cooling; data center cooling; device level thermal management; heat conduction; heat pipes; liquid cooling; microfluidics; nano-enhanced thermal management; phase change material; refrigeration; reliability; stacked dies; thermal interface material; thermoelectronics; transient heat transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501340
  • Filename
    5501340
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2888627