DocumentCode :
2889299
Title :
Design and analysis of high-performance air-cooled heat exchanger with an integrated capillary-pumped loop heat pipe
Author :
McCarthy, Matthew ; Peters, Teresa ; Allison, Jon ; Espinosa, Alonso ; Jenicek, David ; Kariya, Arthur ; Koveal, Catherine ; Brisson, John G. ; Lang, Jeffrey H. ; Wang, Evelyn N.
Author_Institution :
Dept. of Mech. Eng., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2010
fDate :
2-5 June 2010
Firstpage :
1
Lastpage :
8
Abstract :
We report the design and analysis of a high-power air-cooled heat exchanger capable of dissipating over 1000 W with 33 W of input electrical power and an overall thermal resistance of less than 0.05 K/W. The novelty of the design combines the blower and heat sink into an integrated compact unit (4" × 4" × 4") to maximize the heat transfer area and reduce the required airflow rates and power. The device consists of multiple impeller blades interdigitated with parallel-plate condensers of a capillary-pumped loop heat pipe. The impellers are supported on a common shaft and powered with a low-profile permanent magnet synchronous motor, while a single flat-plate evaporator is connected to the heat load.
Keywords :
blades; heat exchangers; heat pipes; heat sinks; impellers; permanent magnet motors; synchronous motors; thermal management (packaging); thermal resistance; airflow rates; blower; electrical power; heat load; heat sink; high-performance air-cooled heat exchanger; high-power air-cooled heat exchanger; integrated capillary-pumped loop heat pipe; integrated compact unit; low-profile permanent magnet synchronous motor; multiple impeller blades; parallel-plate condensers; power 33 W; single flat-plate evaporator; thermal resistance; Blades; Cogeneration; Electric resistance; Heat engines; Heat sinks; Heat transfer; Impellers; Permanent magnet motors; Shafts; Thermal resistance; air cooling; capillary-pumped; heat exchanger; loop heat pipe; permanent-magnet motor; wick;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
ISSN :
1087-9870
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2010.5501375
Filename :
5501375
Link To Document :
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