Thermal management of an electronical device using PCM embedded in a pin fin heat sink

Phase Change Materials (PCM) have high fusion heat capacity so that they can absorb large amounts of energy before melting. The temperature of a PCM remains almost constant during the phase change, a property which is useful for keeping the subject around the PCM at a uniform temperature. Therefore, PCM is a widely used material in the thermal solutions of time-dependent problems. In this study, thermal control of an electronical device has been carried out using organic and inorganic PCMs. Since thermal conductivity of PCM is very low, pin fin heat sink has been used to increase the conductivity and surface area. In the device, heat sources are not in direct contact with PCM.