Title :
Foreword the submicron era begins
Author_Institution :
General Electric RID, Schenectady, NY, USA
Abstract :
Presents the foreword message of the conference proceedings.
Keywords :
ISSCC digest foreword;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1987 IEEE International
Conference_Location :
New York, NY, USA
DOI :
10.1109/ISSCC.1987.1157200
