Title :
Session 18 test and packaging [breaker page]
Author_Institution :
Technical University, Institute of Microelectronics, West Berlin, Germany
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Test and packaging;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1987 IEEE International
Conference_Location :
New York, NY, USA
DOI :
10.1109/ISSCC.1987.1157201
