• DocumentCode
    2889447
  • Title

    Session 18 test and packaging [breaker page]

  • Author

    Berger, H.

  • Author_Institution
    Technical University, Institute of Microelectronics, West Berlin, Germany
  • Volume
    XXX
  • fYear
    1987
  • fDate
    0-0 Feb. 1987
  • Firstpage
    223
  • Lastpage
    223
  • Abstract
    Start of the above-titled section of the conference proceedings record.
  • Keywords
    Test and packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference. Digest of Technical Papers. 1987 IEEE International
  • Conference_Location
    New York, NY, USA
  • Type

    conf

  • DOI
    10.1109/ISSCC.1987.1157201
  • Filename
    1157201
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2889447