• DocumentCode
    2889539
  • Title

    A production fab defect reduction program

  • Author

    Henderson, Ian

  • Author_Institution
    Signetics, Albuquerque, NM, USA
  • fYear
    1989
  • fDate
    22-24 May 1989
  • Firstpage
    58
  • Lastpage
    60
  • Abstract
    The author describes a defect reduction program in a production manufacturing environment and shows how the need for lower defect levels was translated into a program with measurable cost and yield benefits. This program has several significant elements: a visual defect inspection program, the use of statistical process control, the use of direct electronic data collection for a laser particle counter program, and the use of an electronic defect monitor. The results have been positive and have resulted in lower die costs for this wafer fabrication process
  • Keywords
    inspection; integrated circuit manufacture; quality control; statistical process control; direct electronic data collection; electronic defect monitor; laser particle counter program; lower die costs; production fab defect reduction program; production manufacturing environment; significant elements; statistical process control; visual defect inspection program; wafer fabrication process; Automatic control; Circuits; Electronics industry; Environmental economics; Failure analysis; Inspection; Production; Pulp manufacturing; Resource management; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International
  • Conference_Location
    Burlingame, CA
  • Type

    conf

  • DOI
    10.1109/ISMSS.1989.77244
  • Filename
    77244