DocumentCode
2889539
Title
A production fab defect reduction program
Author
Henderson, Ian
Author_Institution
Signetics, Albuquerque, NM, USA
fYear
1989
fDate
22-24 May 1989
Firstpage
58
Lastpage
60
Abstract
The author describes a defect reduction program in a production manufacturing environment and shows how the need for lower defect levels was translated into a program with measurable cost and yield benefits. This program has several significant elements: a visual defect inspection program, the use of statistical process control, the use of direct electronic data collection for a laser particle counter program, and the use of an electronic defect monitor. The results have been positive and have resulted in lower die costs for this wafer fabrication process
Keywords
inspection; integrated circuit manufacture; quality control; statistical process control; direct electronic data collection; electronic defect monitor; laser particle counter program; lower die costs; production fab defect reduction program; production manufacturing environment; significant elements; statistical process control; visual defect inspection program; wafer fabrication process; Automatic control; Circuits; Electronics industry; Environmental economics; Failure analysis; Inspection; Production; Pulp manufacturing; Resource management; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International
Conference_Location
Burlingame, CA
Type
conf
DOI
10.1109/ISMSS.1989.77244
Filename
77244
Link To Document