Title :
A production fab defect reduction program
Author_Institution :
Signetics, Albuquerque, NM, USA
Abstract :
The author describes a defect reduction program in a production manufacturing environment and shows how the need for lower defect levels was translated into a program with measurable cost and yield benefits. This program has several significant elements: a visual defect inspection program, the use of statistical process control, the use of direct electronic data collection for a laser particle counter program, and the use of an electronic defect monitor. The results have been positive and have resulted in lower die costs for this wafer fabrication process
Keywords :
inspection; integrated circuit manufacture; quality control; statistical process control; direct electronic data collection; electronic defect monitor; laser particle counter program; lower die costs; production fab defect reduction program; production manufacturing environment; significant elements; statistical process control; visual defect inspection program; wafer fabrication process; Automatic control; Circuits; Electronics industry; Environmental economics; Failure analysis; Inspection; Production; Pulp manufacturing; Resource management; Semiconductor device manufacture;
Conference_Titel :
Semiconductor Manufacturing Science Symposium, 1989. ISMSS 1989., IEEE/SEMI International
Conference_Location :
Burlingame, CA
DOI :
10.1109/ISMSS.1989.77244