DocumentCode :
2889753
Title :
Data framework for VLSI design
Author :
Milo, A. ; Nehab, S.
Author_Institution :
Motorola Semiconductor Israel Ltd., Tel-Aviv, Israel
fYear :
1991
fDate :
11-14 Nov. 1991
Firstpage :
140
Lastpage :
143
Abstract :
The authors present a design automation framework (DAF) implementation that was developed in an advanced full custom IC design environment at Motorola Semiconductor Israel. This framework, named TDF (Tools and Data Framework), operates in a large-scale multi-user, multi-node environment. TDF successfully supports all the necessary requirements of a VLSI design framework: data hiding, versioning, atomicity, and recovery of mass files operations; and concurrency control and data sharing for design-team work. In addition to the extensive data management services, TDF provides an open environment for tool integration. The authors emphasize two aspects of TDF: the data model and the dynamic configuration mechanism. The data model directly reflects the data partitioning of IC designs, thereby allowing efficient navigation in the design database. The dynamic configuration mechanism is a simple and powerful format for the definition of ad hoc configurations, such as design integration, revisions freeze, and mixed view.<>
Keywords :
VLSI; circuit CAD; configuration management; TDF; VLSI design; ad hoc configurations; atomicity; concurrency control; data hiding; data management services; data model; data partitioning; data sharing; design automation framework; design integration; design-team work; dynamic configuration mechanism; full custom IC design environment; mixed view; recovery; revisions freeze; versioning; Atomic measurements; Concurrency control; Data encapsulation; Data models; Design automation; Environmental management; Integrated circuit modeling; Large-scale systems; Navigation; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer-Aided Design, 1991. ICCAD-91. Digest of Technical Papers., 1991 IEEE International Conference on
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-8186-2157-5
Type :
conf
DOI :
10.1109/ICCAD.1991.185214
Filename :
185214
Link To Document :
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