• DocumentCode
    2889884
  • Title

    Boundary-condition-independent reduced-order modeling of 3D objects by the POD-Galerkin methodology

  • Author

    Raghupathy, Arun Prakash ; Maltz, William ; Ghia, Urmila ; Ghia, Karman

  • Author_Institution
    Electron. Cooling Solutions Inc., Santa Clara, CA, USA
  • fYear
    2010
  • fDate
    2-5 June 2010
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    The objective of the current work is to introduce the concept of boundary-condition-independent (BCI) reduced-order modeling (ROM) for complex electronic packages by the POD-Galerkin methodology. This work focuses on how the Proper Orthogonal Decomposition (POD)-Galerkin methodology can be used with the Finite Volume (FV) method to generate reduced-order models that are boundary-condition-independent. The method has been successfully implemented to generate boundary-condition-independent reduced-order thermal models for 1D and 2D objects. In this paper, the POD-Galerkin methodology is extended to generate a boundary-condition-independent model for a simple 3D object and a 3D object with a single heat source. Specific objectives of extending the methodology to 3D objects is to identify the correct number and type of snapshots used for constructing the reduced-order model and to identify the minimum number of POD basis vectors to generate the boundary-condition-independent reduced order model. Boundary-condition-independent reduced-order models generated for the 3D objects for isoflux boundary conditions show less than 4% relative error for a range of heat transfer coefficient of h = 1 W/m2K and h = 1000 W/m2K. The biggest advantage of this methodology is the potential of being integrated into commercial computational fluid dynamics software with minimal modifications.
  • Keywords
    Galerkin method; computational fluid dynamics; Galerkin methodology; boundary-condition-independent; complex electronic packages; computational fluid dynamics; proper orthogonal decomposition; reduced-order modeling; Boundary conditions; Computational fluid dynamics; Electronic packaging thermal management; Electronics cooling; Finite volume methods; Heat transfer; Isothermal processes; Laboratories; Read only memory; Reduced order systems; Boundary Condition Independent Models; Proper Orthogonal Decomposition; Reduced-order Models;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-5342-9
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2010.5501406
  • Filename
    5501406