Title :
Fundamental study on heat transfer characteristics of microencapsulated phase change material suspensions flowing in circular mini-pipe
Author :
Nakagawa, Shinji ; Hashimoto, Takehiro ; Hayashi, Tatsuya ; Hatakeyama, Tomoyuki ; Ishizuka, Masaru
Author_Institution :
Toyama Prefectural Univ., Toyama, Japan
Abstract :
Fundamental thermal performance of a liquid cooling system for small electronic equipment has been examined in this paper. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a mini-pipe and a microencapsulated phase change material (MEPCM). The coolant including the MEPCM with an average diameter of 3 μm was supplied into the mini-pipe having a diameter of 1 mm. The mass concentration of MEPCM was changed from 0 to 5%. The increase of the mass concentration reduces the temperature rise of the heated pipe wall.
Keywords :
cooling; electronic equipment testing; encapsulation; heat pipes; phase change materials; thermal management (packaging); circular mini-pipe; electronic component; heat generation density; heat transfer; heated pipe wall; liquid cooling system; mass concentration; microencapsulated phase change material; small electronic equipment; thermal performance; Electronic equipment; Electronics cooling; Heat transfer; Liquid cooling; Phase change materials; Slurries; Suspensions; Temperature measurement; Thermal conductivity; Wire; electronics cooling; heat transfer enhancement; liquid cooling; microencapsulated phase change material; mini-pipe;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-5342-9
Electronic_ISBN :
1087-9870
DOI :
10.1109/ITHERM.2010.5501410
