Fundamental study on heat transfer characteristics of microencapsulated phase change material suspensions flowing in circular mini-pipe

Author

Nakagawa, Shinji ; Hashimoto, Takehiro ; Hayashi, Tatsuya ; Hatakeyama, Tomoyuki ; Ishizuka, Masaru

Author_Institution

Toyama Prefectural Univ., Toyama, Japan

fYear

2010

fDate

2-5 June 2010

Firstpage

1

Lastpage

4

Abstract

Fundamental thermal performance of a liquid cooling system for small electronic equipment has been examined in this paper. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a mini-pipe and a microencapsulated phase change material (MEPCM). The coolant including the MEPCM with an average diameter of 3 μm was supplied into the mini-pipe having a diameter of 1 mm. The mass concentration of MEPCM was changed from 0 to 5%. The increase of the mass concentration reduces the temperature rise of the heated pipe wall.

Keywords

cooling; electronic equipment testing; encapsulation; heat pipes; phase change materials; thermal management (packaging); circular mini-pipe; electronic component; heat generation density; heat transfer; heated pipe wall; liquid cooling system; mass concentration; microencapsulated phase change material; small electronic equipment; thermal performance; Electronic equipment; Electronics cooling; Heat transfer; Liquid cooling; Phase change materials; Slurries; Suspensions; Temperature measurement; Thermal conductivity; Wire; electronics cooling; heat transfer enhancement; liquid cooling; microencapsulated phase change material; mini-pipe;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1087-9870

Print_ISBN

978-1-4244-5342-9

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2010.5501410

Filename

5501410