DocumentCode
2893362
Title
600 kHz Compact Power Supply Module
Author
Satoh, Mitsuo ; Usui, Yosinori ; Suzuki, Tomoo
Author_Institution
FUJITSU LIMITED, 1015, Kamiodanaka, Nakahara-ku, Kawasaki-shi, JAPAN
fYear
1986
fDate
19-22 Oct. 1986
Firstpage
607
Lastpage
613
Abstract
As equipment has become more compact and reliable, it is essential that the power supply unit also be compact and reliable. In the past, the use of high frequency switching was one way to miniaturize power supply equipment. In recent years, MOS FET has been developed, enabling switching up to several megahertz. This now requires that the optimum switching frequency be determined. Since parts have become miniaturized they can be more densely packaged. Although this reduces the required packaging space, it increases the temperature. This has been a big factor in determining the reliability and service life of the equipment. This paper explains how the optimum switching frequency was determined by studying the losses and sizes of the parts. It also explains the design used for the high-density package, and compares the measured data with the computer simulation data on a 600 kHz compact power supply module.
Keywords
Circuits; Copper; MOSFETs; Packaging machines; Power supplies; Proximity effect; Rectifiers; Smoothing methods; Switching frequency; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Telecommunications Energy Conference, 1986. INTELEC '86. International
Conference_Location
Toronto, Canada
Print_ISBN
0-9692316-1-X
Type
conf
DOI
10.1109/INTLEC.1986.4794489
Filename
4794489
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