A telemetric stress-mapping CMOS chip with 24 FET-based stress sensors for smart orthodontic brackets

With ongoing miniaturization in technology and increasing complexity in assembly and packaging, stress-sensing microsystems gain importance for the evaluation of IC packages. Additionally, integrated stress-sensor systems are attractive for miniaturized force and torque sensing in various fields. The chip presented here is designed for the next generation of smart brackets, i.e. intelligent orthodontic brackets serving the orthodontist with measured loads applied to each treated tooth during therapy. Furthermore, wireless communication is beneficial for achieving access to harsh environments and to reduce maintenance, and is mandatory for clinical smart brackets.