A 65nm CMOS fully integrated transceiver module for 60GHz wireless HD applications

Author

Siligaris, Alexandre ; Richard, Olivier ; Martineau, Baudouin ; Mounet, Christopher ; Chaix, Fabrice ; Ferragut, Romain ; Dehos, Cedric ; Lanteri, Jerome ; Dussopt, Laurent ; Yamamoto, Silas D. ; Pilard, Romain ; Busson, Pierre ; Cathelin, Andreia ; Belot

Author_Institution

CEA-LETI-MINATEC, Grenoble, France

fYear

2011

fDate

20-24 Feb. 2011

Firstpage

162

Lastpage

164

Abstract

This paper presents a fully integrated 60GHz transceiver module in a 65nm CMOS technology for wireless high-definition video streaming. The CMOS chip is compatible with the WirelessHD™ standard, covers the four channels and supports 16-QAM OFDM signals including the analog baseband. The ESD-protected die (9.3mm2) is flip-chipped atop a High Temperature Cofired Ceramic (HTCC) substrate, which receives also an external PA and the emission and reception glass-substrate antennas. The module occupies an area of only 13.5χ8.5mm2. It consumes 454mW in receiver mode and 1.357W in transmitter mode (357mW for the transmitter and 1W for the PA).

Keywords

CMOS integrated circuits; OFDM modulation; quadrature amplitude modulation; radio transceivers; video streaming; 16-QAM OFDM signals; CMOS technology; ESD-protected die; WirelessHD standard; frequency 60 GHz; fully integrated transceiver module; high temperature cofired ceramic substrate; reception glass-substrate antennas; size 65 nm; wireless high-definition video streaming; Baseband; CMOS integrated circuits; OFDM; Radio frequency; Substrates; Transceivers; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International

Conference_Location

San Francisco, CA

ISSN

0193-6530

Print_ISBN

978-1-61284-303-2

Type

conf

DOI

10.1109/ISSCC.2011.5746264

Filename

5746264