DocumentCode :
2893788
Title :
A 65nm CMOS fully integrated transceiver module for 60GHz wireless HD applications
Author :
Siligaris, Alexandre ; Richard, Olivier ; Martineau, Baudouin ; Mounet, Christopher ; Chaix, Fabrice ; Ferragut, Romain ; Dehos, Cedric ; Lanteri, Jerome ; Dussopt, Laurent ; Yamamoto, Silas D. ; Pilard, Romain ; Busson, Pierre ; Cathelin, Andreia ; Belot
Author_Institution :
CEA-LETI-MINATEC, Grenoble, France
fYear :
2011
fDate :
20-24 Feb. 2011
Firstpage :
162
Lastpage :
164
Abstract :
This paper presents a fully integrated 60GHz transceiver module in a 65nm CMOS technology for wireless high-definition video streaming. The CMOS chip is compatible with the WirelessHD™ standard, covers the four channels and supports 16-QAM OFDM signals including the analog baseband. The ESD-protected die (9.3mm2) is flip-chipped atop a High Temperature Cofired Ceramic (HTCC) substrate, which receives also an external PA and the emission and reception glass-substrate antennas. The module occupies an area of only 13.5χ8.5mm2. It consumes 454mW in receiver mode and 1.357W in transmitter mode (357mW for the transmitter and 1W for the PA).
Keywords :
CMOS integrated circuits; OFDM modulation; quadrature amplitude modulation; radio transceivers; video streaming; 16-QAM OFDM signals; CMOS technology; ESD-protected die; WirelessHD standard; frequency 60 GHz; fully integrated transceiver module; high temperature cofired ceramic substrate; reception glass-substrate antennas; size 65 nm; wireless high-definition video streaming; Baseband; CMOS integrated circuits; OFDM; Radio frequency; Substrates; Transceivers; Wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-61284-303-2
Type :
conf
DOI :
10.1109/ISSCC.2011.5746264
Filename :
5746264
Link To Document :
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