• DocumentCode
    2894209
  • Title

    A 4Mb conductive-bridge resistive memory with 2.3GB/s read-throughput and 216MB/s program-throughput

  • Author

    Otsuka, Wataru ; Miyata, Koji ; Kitagawa, Makoto ; Tsutsui, Keiichi ; Tsushima, Tomohito ; Yoshihara, Hiroshi ; Namise, Tomohiro ; Terao, Yasuhiro ; Ogata, Kentaro

  • Author_Institution
    Sony, Atsugi, Japan
  • fYear
    2011
  • fDate
    20-24 Feb. 2011
  • Firstpage
    210
  • Lastpage
    211
  • Abstract
    The growing demand for higher performance in the storage and access of data in various consumer electronic and computing devices has driven the development of nonvolatile memory (NVM) technologies. The promising candidates for future NVM such as FeRAM and PCM have demonstrated shorter access time, faster programming and wide read/write bandwidth in the chip and the memory macro. Resistive memory (ReRAM) is also one of alternative NVMs, because of its low operating voltage, high speed and good scalability. Several types of ReRAM characteristics have been investigated on memory array. However, most are limited in terms of memory array performance because of not having suitable read/write circuit for ReRAM. In this work, we present a 4Mb conductive bridge ReRAM test macro realizing 2.3GB/S read-throughput, 216MB/S program-throughput and robust reliability results by using read/write fully functional device technology with direct sense in programming (DSIP) method.
  • Keywords
    memory architecture; random-access storage; computing device; conductive bridge ReRAM test macro; conductive-bridge resistive memory; consumer electronic; memory array performance; memory macro; nonvolatile memory technology; program-throughput; read-throughput; read/write circuit; read/write fully functional device technology; robust reliability; storage capacity 4 Mbit; Arrays; Clocks; Driver circuits; Nonvolatile memory; Programming; Resistance; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-61284-303-2
  • Type

    conf

  • DOI
    10.1109/ISSCC.2011.5746286
  • Filename
    5746286