• DocumentCode
    2895515
  • Title

    An approach to modeling labor and machine down time in semiconductor fabrication

  • Author

    Baum, Susan S. ; O´Donnell, C.M.

  • Author_Institution
    NCR Microelectronic Products, Fort Collins, CO, USA
  • fYear
    1991
  • fDate
    8-11 Dec 1991
  • Firstpage
    448
  • Lastpage
    454
  • Abstract
    The authors present an approach to modeling labor resources, random equipment failures, and preventative maintenance in a wafer fabrication facility, and address their inherent complexities. This approach was implemented in a simulation model of an ASIC (application-specific integrated circuit) wafer fabrication facility, developed using the SIMAN simulation language. The important features of the model are its ability to accurately model labor separately from pure equipment processing time, and to model both scheduled and unscheduled maintenance activities. The labor model considers operator skills, man-machine ratios, and proximity of resources being monitored. This allows the simulation analyst to consider the effects of changes in production starts on labor requirements. The equipment downtime model accurately reflects the impact of random machine failures, when the data are available. This allows the analyst to evaluate the impact on cycle times and throughput of improving the uptime performance of a machine
  • Keywords
    discrete event simulation; integrated circuit manufacture; maintenance engineering; ASIC; SIMAN simulation language; application-specific integrated circuit; cycle times; equipment downtime model; labor requirements; labor resources; man-machine ratios; operator skills; preventative maintenance; random equipment failures; random machine failures; semiconductor fabrication; throughput; unscheduled maintenance activities; uptime performance; wafer fabrication facility; Application specific integrated circuits; Circuit simulation; Condition monitoring; Equipment failure; Fabrication; Integrated circuit modeling; Labor resources; Man machine systems; Preventive maintenance; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 1991. Proceedings., Winter
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    0-7803-0181-1
  • Type

    conf

  • DOI
    10.1109/WSC.1991.185646
  • Filename
    185646