Title :
Silicon mosaic for integrated devices
Author_Institution :
Bell Telephone Laboratories, Inc., Murray Hill, NJ, USA
Keywords :
Bonding; Conductivity; Diodes; Geometry; Glass; Integrated circuit interconnections; Parasitic capacitance; Silicon; Slabs; Substrates;
Conference_Titel :
Solid-State Circuits Conference. Digest of Technical Papers. 1964 IEEE International
Conference_Location :
Philadelphia, PA, USA
DOI :
10.1109/ISSCC.1964.1157530
