• DocumentCode
    2896000
  • Title

    Flip-Flop Selection for Transition Test Pattern Reduction Using Partial Enhanced Scan

  • Author

    Pei, Songwei ; Li, Huawei ; Li, Xiaowei

  • Author_Institution
    Key Lab. of Comput. Syst. & Archit., Chinese Acad. of Sci., Beijing, China
  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Firstpage
    75
  • Lastpage
    80
  • Abstract
    Enhanced scan delay testing approach can achieve high transition delay fault coverage by a small size of test pattern set but with significant hardware overhead. Although the implementation cost of launch on capture (LOC) approach is relatively low, the generated pattern set for testing delay faults is typically very large. In this paper, we present a novel flip-flop selection method to combine the respective advantages of the two approaches, by replacing a small number of selected regular scan cells with enhanced scan cells, thus to reduce the overall volume of transition delay test patterns effectively. Moreover, higher fault coverage can also be obtained by this approach compared to the standard LOC approach. Experimental results on larger ISCAS-89 and ITC-99 benchmark circuits using a commercial test generation tool show that the volume of test patterns can be reduced by over 70% and the transition delay fault coverage can be improved by up to 8.7%.
  • Keywords
    automatic test pattern generation; fault diagnosis; flip-flops; logic circuits; ISCAS-89 benchmark circuit; ITC-99 benchmark circuit; LOC approach; commercial test generation tool; fault coverage; flip-flop selection; partial enhanced scan; transition delay test patterns; transition test pattern reduction; Circuit faults; Circuit testing; Costs; Delay; Flip-flops; Hardware; Lab-on-a-chip; System testing; Test pattern generators; Timing; Enhanced Scan Cell; Fault Coverage; Flip-flop Selection; Launch on Capture; Test Pattern Reduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dependable Computing, 2009. PRDC '09. 15th IEEE Pacific Rim International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3849-5
  • Type

    conf

  • DOI
    10.1109/PRDC.2009.20
  • Filename
    5368217