Title :
The use of lasers for the soldering of high density interconnects
Author :
Beckett, P.M. ; Fleming, A.R. ; Foster, R.J. ; Gilbert, J.M. ; Whitehead, D.G.
Author_Institution :
Hull Univ., UK
Abstract :
Lasers play an increasingly important role in materials processing, typically in hole drilling, cutting, welding and heat treatment. In this paper we present a further application for lasers in manufacturing and assembly-that of the soldering of electronic components
Keywords :
assembling; fine-pitch technology; laser beam applications; printed circuit manufacture; soldering; PCBs; assembly; electronic components; fine pitch; high density interconnects; laser soldering; materials processing;
Conference_Titel :
Interconnection Technology (Digest No.1994/220), IEE Colloquium on
Conference_Location :
London
