Conducting adhesives for high density interconnection

Over the last decade the use of SMT has rapidly replaced through hole component mounting technology. The lead pitch of these surface mounted components has been driven down by the higher pin counts of increasingly complex IC´s and by the miniaturisation of electronics systems for portable systems. This push to finer pitch/higher density I/O has meant a revolution in conventional joining and the development of new generations of technology. In this context the authors discuss the properties and use of conductive adhesive materials