Title :
Organic substrates for miniaturisation at low cost
Author_Institution :
GEC-Marconi Res. Centre, Chelmsford, UK
Abstract :
The most commonly used method of supporting and interconnecting electronic devices is the printed circuit board, an organic substrate with copper conductors. Major advances in device functions have forced concepts of packaging and interconnection to change radically to exploit these device advances. To meet both functional and economic requirements of advanced systems, PCB manufacturers are beginning to offer products which meet and even exceed the present and future needs of system designers. MICROTRACE is a high interconnect density pcb manufactured by GEC-Marconi Interconnect. This paper sets out to describe this technology, its position in the market and its applications with the perspective of illustrating electronic miniaturisation at low cost
Keywords :
organic compounds; printed circuits; substrates; Cu; GEC-Marconi Interconnect; MICROTRACE; copper conductors; electronic devices; electronic miniaturisation; high interconnect density PCB; interconnection; low cost; organic substrates; packaging; printed circuit board; support;
Conference_Titel :
Interconnection Technology (Digest No.1994/220), IEE Colloquium on
Conference_Location :
London