DocumentCode :
289639
Title :
Organic substrates for miniaturisation at low cost
Author :
Tyler, S.G.
Author_Institution :
GEC-Marconi Res. Centre, Chelmsford, UK
fYear :
1994
fDate :
34655
Firstpage :
42370
Lastpage :
42372
Abstract :
The most commonly used method of supporting and interconnecting electronic devices is the printed circuit board, an organic substrate with copper conductors. Major advances in device functions have forced concepts of packaging and interconnection to change radically to exploit these device advances. To meet both functional and economic requirements of advanced systems, PCB manufacturers are beginning to offer products which meet and even exceed the present and future needs of system designers. MICROTRACE is a high interconnect density pcb manufactured by GEC-Marconi Interconnect. This paper sets out to describe this technology, its position in the market and its applications with the perspective of illustrating electronic miniaturisation at low cost
Keywords :
organic compounds; printed circuits; substrates; Cu; GEC-Marconi Interconnect; MICROTRACE; copper conductors; electronic devices; electronic miniaturisation; high interconnect density PCB; interconnection; low cost; organic substrates; packaging; printed circuit board; support;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Interconnection Technology (Digest No.1994/220), IEE Colloquium on
Conference_Location :
London
Type :
conf
Filename :
383878
Link To Document :
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