DocumentCode
2896864
Title
Integrated EM & thermal simulation with VORPAL software
Author
Smithe, David ; Crockett, Robert ; Wang, Haipeng ; Cheng, Gary
Author_Institution
Tech-X Corp., Boulder, CO, USA
fYear
2012
fDate
24-26 April 2012
Firstpage
27
Lastpage
28
Abstract
The VORPAL finite-difference time-domain particle-in-cell simulation tool now has thermal solver capability, which we are using to model transmission lines and accelerating cavities of cryogenic SRF accelerators. This same capability can be brought to bear on room temperature problems EM and Thermal physics. Our thermal solver treats the non-linear evolution of the material properties, such as electrical and thermal conductivity. We have recently upgraded our thermal solver to allow for implicit solves with larger time-steps, consistent with problems having material interfaces with drastically different (~105) thermal conductivities. We present benchmarks of integrated problems including a coaxial feed-through into a high-order mode coupler, and time-domain modeling of cryogenic quench events.
Keywords
coaxial waveguides; cryogenic electronics; electrical conductivity; electromagnetic field theory; finite difference time-domain analysis; thermal conductivity; transmission lines; VORPAL software; accelerating cavities; coaxial feed-through; cryogenic SRF accelerators; cryogenic quench events; electrical conductivity; finite-difference time-domain simulation; high-order mode coupler; integrated EM simulation; material properties; nonlinear evolution; particle-in-cell simulation; thermal conductivity; thermal physics; thermal simulation; thermal solver; time-domain modeling; transmission lines; Benchmark testing; Electromagnetics; Geometry; Materials; Software; Solid modeling; Thermal conductivity; VORPAL; cryogenic; cut-cell boundaries; electromagnetic analysis; finite-difference; integrated software; multiple effects; thermal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Electronics Conference (IVEC), 2012 IEEE Thirteenth International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4673-0188-6
Electronic_ISBN
978-1-4673-0187-9
Type
conf
DOI
10.1109/IVEC.2012.6262060
Filename
6262060
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