DocumentCode
2897236
Title
Session 8 overview / wireline: Architectures & circuits for next generation wireline transceivers
Author
Friedman, Daniel ; Yamaguchi, Koichi
Author_Institution
IBM T. J. Watson Research Center, Yorktown Heights, NY
fYear
2011
fDate
20-24 Feb. 2011
Firstpage
140
Lastpage
141
Abstract
Summary form only given. Meeting the challenges for next generation communication systems demands a combination of circuit and architecture innovation. Circuit innovation, by extending the performance achievable using CMOS technologies, yields increasingly flexible standard-compliant designs, allows data rates to be pushed to new levels, and enables the creation of new ways to mitigate deep submicron technology constraints. Architecture innovation will have longer-term impact in areas ranging from addressing serial link power challenges to creating entirely new serial link application spaces.
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-61284-303-2
Type
conf
DOI
10.1109/ISSCC.2011.5746441
Filename
5746441
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