• DocumentCode
    2897236
  • Title

    Session 8 overview / wireline: Architectures & circuits for next generation wireline transceivers

  • Author

    Friedman, Daniel ; Yamaguchi, Koichi

  • Author_Institution
    IBM T. J. Watson Research Center, Yorktown Heights, NY
  • fYear
    2011
  • fDate
    20-24 Feb. 2011
  • Firstpage
    140
  • Lastpage
    141
  • Abstract
    Summary form only given. Meeting the challenges for next generation communication systems demands a combination of circuit and architecture innovation. Circuit innovation, by extending the performance achievable using CMOS technologies, yields increasingly flexible standard-compliant designs, allows data rates to be pushed to new levels, and enables the creation of new ways to mitigate deep submicron technology constraints. Architecture innovation will have longer-term impact in areas ranging from addressing serial link power challenges to creating entirely new serial link application spaces.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2011 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-61284-303-2
  • Type

    conf

  • DOI
    10.1109/ISSCC.2011.5746441
  • Filename
    5746441