Title :
Design For Reliabiltiy
Author :
Rennels, David A. ; Tamir, Yuval ; Tyree, Vance C.
Author_Institution :
University of California Los Angeles
Keywords :
Circuit faults; Computer science; Fabrication; Packaging; Power dissipation; Power system reliability; Senior members; Single event upset; Total quality management; Voltage;
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
DOI :
10.1109/IWLR.1992.657980