DocumentCode :
2897923
Title :
Building-in Reliability at SGC-THOMSON Microelectronics
Author :
Hoang, Hoang Huy
Author_Institution :
Process Reliability Engineering
fYear :
1992
fDate :
25-28 Oct. 1992
Firstpage :
44
Lastpage :
53
Keywords :
Microelectronics; Production; Reliability engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
Type :
conf
DOI :
10.1109/IWLR.1992.657983
Filename :
657983
Link To Document :
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