مرکز منطقه ای اطلاع رساني علوم و فناوري - Building In Reliability For Packaging And Assembly

DocumentCode :

2898261

Title :

Building In Reliability For Packaging And Assembly

Author :

Shirley, C. Glenn

Author_Institution :

Intel Corporation

fYear :

1992

fDate :

25-28 Oct. 1992

Firstpage :

Lastpage :

Keywords :

Assembly; Copper; Gold; Plastic packaging; Product development; Silicon; Testing; Very large scale integration; Wafer bonding; Wire;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Wafer Level Reliability Workshop, 1992. Final Report., 1992 International

Conference_Location :

Lake Tahoe, CA, USA

Type :

conf

DOI :

10.1109/IWLR.1992.657985

Filename :

657985

Link To Document :