Impact of molding parameters on PBGA warpage characteristic

PBGA (Plastic Ball Grid Array) has been around for years as the leading packaging technology for I/O controller. Occasionally PBGA package exhibits surface mount issues, typically the solder bridging, at very low defect per million. A series of investigation was carried out to address the key design modulators. This paper discussed the findings of how molding temperature could modulate the dynamic warpage characteristic of a PBGA package. Apart from design factors, the molding temperature plays significant role in reducing warpage at reflow temperature.