Title :
Resolving thermal resistance problem of Analog device in conjunction with the ONxx Shrink Die Technology
Author :
Yabut, Yolando G. ; Reyes, Albert M.
Author_Institution :
Bus. Unit & Product Eng. Dept., ON Semicond. Philippines Inc., Cavite, Philippines
fDate :
Nov. 30 2010-Dec. 2 2010
Abstract :
This paper will discuss the in-depth details and experiments done to address the thermal resistance of Analog device thus paving the release and qualification of ONxx Shrink Die Technology hitting corporate drive of sure cost saving projects and bringing ON Semiconductor Philippines Incorporated to desire level of competitiveness. A closer look on the variables that contribute to these phenomena will single out on the materials that had direct impact on the problems. By introducing new bill of material from the current practice, thermal resistance problem were address enhancing convection process of integrated circuits built moreover this convective resistance parameters to include temperature drop across layers, thermal conductivity and fluidity of the epoxy, validate the desired action needed to resolve this qualification.
Keywords :
analogue integrated circuits; convection; integrated circuit packaging; thermal conductivity; thermal resistance; ON Semiconductor Philippines Incorporated; analog device; convection process; convective resistance parameters; epoxy fluidity; integrated circuits; shrink die technology; temperature drop; thermal conductivity; thermal resistance problem; Companies; Equations; Heat engines; Junctions; Lead; Qualifications; Switches;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-8825-4
DOI :
10.1109/IEMT.2010.5746704