• DocumentCode
    2898671
  • Title

    Design and modelling of a 40W microwave switch in QFN 2×2 package

  • Author

    Lim, Chin-Leong

  • Author_Institution
    Avago Technol., Bayan Lepas, Malaysia
  • fYear
    2010
  • fDate
    Nov. 30 2010-Dec. 2 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper describes a Quad Flat Non-lead (QFN 2x2) packaged PIN diode switch that is capable of handling Continuous Wave (CW) power up to 40W and WCDMA signal up to 10W. The target application is the Transmit (Tx) arm of a Transmit Receive (TR) switch for cellular base-stations. The part was developed in response to this market segment´s aggressive cut-cutting pressure. Prior designs relied on more expensive ceramic packages.
  • Keywords
    code division multiple access; electronics packaging; microwave switches; p-i-n diodes; PIN diode switch; WCDMA; aggressive cut-cutting pressure; cellular base-station; microwave switch; power 40 W; quad flat nonlead packaging; transmit receive switch; Ceramics; Dielectric measurements; Dielectrics; Fitting; Performance evaluation; Spread spectrum communication; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
  • Conference_Location
    Melaka
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-8825-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2010.5746705
  • Filename
    5746705
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2898671