Alternative robust reliability solution for silver finishing

Author

Goh, Soon-Lock ; Lee, Swee-Kah ; Neoh, Din-Ghee ; Kok, Sia-Wing

Author_Institution

Infineon Technol. (M) Sdn Bhd, Batu Berendam, Malaysia

fYear

2010

fDate

Nov. 30 2010-Dec. 2 2010

Firstpage

1

Lastpage

6

Abstract

In this paper, a silver adhesion promoter process, namely “AgPrep” was introduced for the semiconductor leadframes. The concept of how AgPrep works to improve the adhesion between the silver surface of a leadframe and the epoxy molding compound (EMC) was presented. X-ray Photoelectron Spectroscopy (XPS) analysis was also carried out to study the chemical state of the silver surface after AgPrep´s treatment. Besides, the surface energy of AgPrep´s treated silver was characterized through the contact angle measurements using a drop shape analyzer. Finally, the adhesion performance of AgPrep process was verified in the button shear tests and a series of reliability tests.

Keywords

X-ray spectroscopy; adhesion; finishing; moulding; reliability; AgPrep; X-ray photoelectron spectroscopy; alternative robust reliability; epoxy molding compound; semiconductor leadframes; silver adhesion; silver finishing; Adhesives; Compounds; Copper; Lead; Liquids; Silver; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International

Conference_Location

Melaka

ISSN

1089-8190

Print_ISBN

978-1-4244-8825-4

Type

conf

DOI

10.1109/IEMT.2010.5746708

Filename

5746708