Concurrent design for robust and cost efficient semiconductor manufacturing

Rapid development in the semiconductor industry requires close collaboration between the design and manufacturing teams in order to increase performance, reduce cost and improve the quality of the electronic products manufactured. The current development process is mainly chip-driven design flow that regards package design as a small add-on. This paper proposes the concurrent design concept of chip and package to fully exploit concurrent design benefits to overall product life cycle performance. Successful deployment of the concurrent design concept allows both the chip and package designers from different geographical locations to incorporate the best design attributes into the semiconductor products. This ensures both product quality and reliability requirement are achieved. The concurrent design concept is further expanded by the introduction of group technology approach into lead frame design for better cost management.