Fabrication of silica/epoxy thin film composite for electronic packaging application

Conventional packaging technology has been replaced in line with the miniaturization trends of the product designs in electronic industry. A polymer resin needs to suit to certain polymer processing methods in order to achieve substantial performance in terms of mechanical, thermal, optical, electrical and so forth. In this study, an epoxy based thin film composite was successfully fabricated by using the spin coating method. Comparing this with the conventional method such as dip coating, solution casting and hot pressing methods, spin coating fabrication method allows controllable-uniform thickness ranging from micron to nanometer. In order to enhance the thermal, mechanical and its dimensional stability, two types of silica fillers which are in micron and nano-sized were studied. The nano-sized silica was found to further enhance the properties of the epoxy thin film at low weight fraction. This is due to its higher ratio of surface area to volume compared to the micron-sized silica.