DocumentCode
2899651
Title
Heterogeneous integration - A key enabling technology
Author
Aschenbrenner, Rolf
Author_Institution
Fraunhofer Inst. For Reliability & Microintegration, IEEE-CPMT Soc., Germany
fYear
2010
fDate
Nov. 30 2010-Dec. 2 2010
Firstpage
1
Lastpage
2
Abstract
Advanced silicon technologies offer the possibility of integrating hundreds of millions of transistors in a single electronic component such as a microprocessor. Experts predict that the increase of components per chip will follow the well known “Moore´s law” in the next decade, too. “Microelectronics” will become “Nanoelectronics”. This trend can be characterized by “More Moore”. If electronic signal and data processing systems are focussed, nanoelectronic components will be very cost efficient due to larger wafer sizes and a high degree of miniaturization (System-on-Chip). But future multifunctional systems require not only more signal and data processing power but also require interfaces to the human sensory organs and altogether functions for an interaction with the environment. Besides these, antennas, components for optical signals and data transmission as well as functions for energy conversion and storage are also needed.
Keywords
system-in-package; system-on-chip; Moore´s law; advanced silicon technology; cost efficient nanoelectronic standard technology; data processing system; data transmission; electronic signal; energy conversion; heterogeneous system integration; high density interconnect multilayer board; human sensory organ; integrated circuit industry; mechanical stress management; microelectronics; microprocessor; miniaturization; multifunctional system technology; multifunctional technology; nanoelectronic component; nanoelectronics; optical signal; radiofrequency function; reliable ultrathin metallic interconnect technology; single-chip packaging; stacked-die SiP solution; system-on-chip; wire bonding; Antennas; Heating; Microprocessors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location
Melaka
ISSN
1089-8190
Print_ISBN
978-1-4244-8825-4
Type
conf
DOI
10.1109/IEMT.2010.5746757
Filename
5746757
Link To Document