• DocumentCode
    2899651
  • Title

    Heterogeneous integration - A key enabling technology

  • Author

    Aschenbrenner, Rolf

  • Author_Institution
    Fraunhofer Inst. For Reliability & Microintegration, IEEE-CPMT Soc., Germany
  • fYear
    2010
  • fDate
    Nov. 30 2010-Dec. 2 2010
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Advanced silicon technologies offer the possibility of integrating hundreds of millions of transistors in a single electronic component such as a microprocessor. Experts predict that the increase of components per chip will follow the well known “Moore´s law” in the next decade, too. “Microelectronics” will become “Nanoelectronics”. This trend can be characterized by “More Moore”. If electronic signal and data processing systems are focussed, nanoelectronic components will be very cost efficient due to larger wafer sizes and a high degree of miniaturization (System-on-Chip). But future multifunctional systems require not only more signal and data processing power but also require interfaces to the human sensory organs and altogether functions for an interaction with the environment. Besides these, antennas, components for optical signals and data transmission as well as functions for energy conversion and storage are also needed.
  • Keywords
    system-in-package; system-on-chip; Moore´s law; advanced silicon technology; cost efficient nanoelectronic standard technology; data processing system; data transmission; electronic signal; energy conversion; heterogeneous system integration; high density interconnect multilayer board; human sensory organ; integrated circuit industry; mechanical stress management; microelectronics; microprocessor; miniaturization; multifunctional system technology; multifunctional technology; nanoelectronic component; nanoelectronics; optical signal; radiofrequency function; reliable ultrathin metallic interconnect technology; single-chip packaging; stacked-die SiP solution; system-on-chip; wire bonding; Antennas; Heating; Microprocessors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
  • Conference_Location
    Melaka
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-8825-4
  • Type

    conf

  • DOI
    10.1109/IEMT.2010.5746757
  • Filename
    5746757