Automotive electronics - Packaging as enabler technology

Automotive mega-trends like fuel efficient cars, safety and - last but not least - E-vehicles drive the increase of electronic content in modern cars. This calls for performance and cost optimized product concepts. Wafer technology, design and packaging are the dimensions for this optimization. Therefore, semiconductor packaging is a key enabler technology for automotive electronics. The main innovation fields are: 1. Further shrink of Silicon die sizes and the trend to higher loads lead to a significant increase of the current density on the device. In addition the requirements for optimizing Rth/Zth become more stringent. New interconnect & package concepts are required. 2. OEM and Tier1 pay more and more attention on package robustness and 2nd level reliability (like TCoB). To satisfy these requirements Infineon has developed proprietary technologies to achieve highest package robustness. In my talk I will give an overview on the innovative package technologies developed by Infineon and map these to the market requirements.