DocumentCode
2899728
Title
Small signal electrical testing in package engineering
Author
Liu, C.S.
Author_Institution
Worldwide Manufacturing, National Semiconductor, USA
fYear
2010
fDate
Nov. 30 2010-Dec. 2 2010
Firstpage
1
Lastpage
1
Abstract
The keynote speaker will provide an insight into today IC test systems and test handlers and their challenges and selection. The key test blocks (functional test or parametric) and key test functions will be examined and illustrated. Interesting case studies on test program and control and limitation for packaging qualification will be discussed in detail including some tips to meet future packaging test challenges.
Keywords
integrated circuit packaging; integrated circuit testing; IC test systems; key test blocks; key test functions; package engineering; packaging qualification; packaging test; small signal electrical testing; test handlers; Engineering profession;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2010 34th IEEE/CPMT International
Conference_Location
Melaka
ISSN
1089-8190
Print_ISBN
978-1-4244-8825-4
Type
conf
DOI
10.1109/IEMT.2010.5746762
Filename
5746762
Link To Document