Title :
Versatility and manufacturability considerations for a new 3-watt X-band power MMIC
Author :
Raicu, D. ; Kraemer, B.M. ; Day, D.S. ; Basset, J.R. ; Wei, J. ; Hua, C. ; Chung, Y. ; Chang, C.S.
Author_Institution :
Avantek Inc., Santa Clara, CA, USA
Abstract :
The authors present a two-stage power amplifying monolithic microwave integrated circuit (MMIC) capable of delivering 3 W at X-band with high efficiency. They describe the utilization of the MMIC designed in applications differing both in frequency range and in bias conditions. This MMIC was designed for operation with external matching circuits on separate ceramic substrates. By customizing these circuits, the same MMIC can cover an entire array of different applications. The versatility of this approach was demonstrated by the implementation of this MMIC in four power modules specified for different bandwidths, power levels, and bias voltages. The small chip size and the tunability allowed by the external circuits resulted in increased manufacturing yields and made possible significant cost reductions.<>
Keywords :
MMIC; field effect integrated circuits; microwave amplifiers; power amplifiers; power integrated circuits; 3 W; X-band; external matching circuits; manufacturability; monolithic microwave integrated circuit; power FET; power MMIC; power modules; tunability; Bandwidth; Ceramics; Costs; Frequency; MMICs; Manufacturing; Microwave integrated circuits; Monolithic integrated circuits; Multichip modules; Voltage;
Conference_Titel :
Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1992. Digest of Papers, IEEE 1992
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-0677-5
DOI :
10.1109/MCS.1992.186039