DocumentCode :
2901034
Title :
BiCMOS ASICs: technology and applications
Author :
Wong, Thomas
Author_Institution :
Semicond. & I.C. Div., Hitachi America Ltd., Brisbane, CA, USA
fYear :
1990
fDate :
17-21 Sep 1990
Abstract :
It is pointed out that although higher speed and lower power dissipation allow BiCMOS to compete with CMOS and ECL devices, CMOS continues to be the choice for large density, low-power, and cost-sensitive application, and ECL remains the preferred choice for very-high-speed medium-density applications. The latter include cache static RAM, telecom, and interface chips between CMOS and fast ECL and TTL memory. BiCMOS now offers system designers an important bridge between power-hungry ECL and high-density CMOS. BiCMOS SRAMs are the most well-known type of high-performance BiCMOS devices. In addition to SRAMS, BiCMOS DRAMs have also been introduced. BiCMOS gate arrays find widespread acceptance in applications such as high-end personal computers, laser printers, workstations, mini-supers, and telecommunications. A relatively new application for BiCMOS technology is in the area of RISC CPUs
Keywords :
BIMOS integrated circuits; DRAM chips; SRAM chips; application specific integrated circuits; integrated circuit technology; logic arrays; BiCMOS ASICs; DRAMs; SRAMs; gate arrays; logic circuits; memory circuits; monolithic IC; Application software; BiCMOS integrated circuits; Bridges; CMOS technology; Microcomputers; Optical arrays; Power dissipation; Random access memory; Read-write memory; Telecommunications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
Conference_Location :
Rochester, NY
Type :
conf
DOI :
10.1109/ASIC.1990.186081
Filename :
186081
Link To Document :
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