Butt-coupled optoelectronic modules for high-speed optical interconnects

This paper presents the Butt-coupled silicon optoelectronic modules for high-speed optical interconnects. The optoelectronic (OE) modules is populated by flip-chip bonding either with VCSELs or detectors placed in direct contact with the waveguides without additional optical elements. The light is guided through the Si module by integrated waveguides based on holes etched through the silicon, which are then oxidized and filled with a polymer. This integrated OE module concept requires only one alignment step in the board and is compatible with a multi-layer waveguide approach. Data transmission of up to 5 Gbps has been demonstrated.