• DocumentCode
    2901117
  • Title

    Wafer Level IC Burn-in As A Step Towards Bir

  • Author

    Miller, James W. ; Soorholtz, Vince ; Vesquez, B.

  • Author_Institution
    Motorola
  • fYear
    1992
  • fDate
    25-28 Oct. 1992
  • Firstpage
    151
  • Lastpage
    162
  • Keywords
    Acceleration; Circuit testing; Costs; Manufacturing; Marketing and sales; Packaging; Production; Reliability engineering; Stress; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Type

    conf

  • DOI
    10.1109/IWLR.1992.657999
  • Filename
    657999
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2901117