• DocumentCode
    2901301
  • Title

    Field emission of uniform carbon cone arrays grown on porous silicon substrate

  • Author

    Wang, Qiang ; Li, Junjie ; Wang, Zongli ; Shi, Chengying ; Li, Haijun ; Gu, Changzhi

  • Author_Institution
    Inst. of Phys., Chinese Acad. of Sci., Beijing, China
  • fYear
    2004
  • fDate
    6-10 Sept. 2004
  • Firstpage
    252
  • Abstract
    Uniform carbon cones arrays with average height of 1μm were grown on porous silicon substrate using the hot filament chemical vapor deposition (HFCVD). Raman spectroscopy was used to characterize as-prepared carbon cones, which are composed of D peak (∼1352cm-1), G peak (-1601cm-1) and a broad peak at ∼1475cm-1 attributed to hydrogenated carbon (a-C:H). It was found that both the immersion of porous silicon substrate in Fe2(SO4)3 aqueous solution and the applied voltage in the deposition are vital to the growth of the carbon cones. Furthermore, the field emission properties of the as-prepared carbon cone arrays were studied, which shows an excellent field emission property. The threshold field is 2.2 V/μm, emission current of more than 80 μA could be obtained as applied electric field is 3.4 V/μm. The internal-tip mechanism has been proposed for cone arrays in order to account for the observed field emission.
  • Keywords
    Raman spectroscopy; carbon; chemical vapour deposition; field emission; hydrogenation; porous semiconductors; silicon; D peak; Fe2SO4; FeSO43 aqueous solution; G peak; Raman spectroscopy; applied electric field; broad peak; field emission properties; hot filament chemical vapor deposition; hydrogenated carbon; internal-tip mechanism; porous silicon substrate; uniform carbon cone arrays; Carbon dioxide; Chemical vapor deposition; Log periodic antennas; Physics; Raman scattering; Silicon; Spectroscopy; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electron Sources Conference, 2004. Proceedings. IVESC 2004. The 5th International
  • Print_ISBN
    0-7803-8437-7
  • Type

    conf

  • DOI
    10.1109/IVESC.2004.1414222
  • Filename
    1414222