مرکز منطقه ای اطلاع رساني علوم و فناوري - Thin Film Cracking / Delamination Evaluation Using Assembly Test Chip

DocumentCode :

2901345

Title :

Thin Film Cracking / Delamination Evaluation Using Assembly Test Chip

Author :

Hong, Charles

Author_Institution :

Intel Corporation

fYear :

1992

fDate :

25-28 Oct. 1992

Firstpage :

163

Lastpage :

166

Keywords :

Assembly; Delamination; Failure analysis; Moisture; Packaging; Passivation; Plastic films; Stress; Testing; Transistors;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Wafer Level Reliability Workshop, 1992. Final Report., 1992 International

Conference_Location :

Lake Tahoe, CA, USA

Type :

conf

DOI :

10.1109/IWLR.1992.658000

Filename :

658000

Link To Document :