DocumentCode
2901399
Title
Solutions to optoelectronic packaging problems
Author
Kumpatla, S. ; Casswell, J.J. ; Snowdon, J.F.
Author_Institution
Sch. of Eng. & Phys. Sci., Heriot-Watt Univ., Edinburgh, UK
fYear
2005
fDate
12-17 June 2005
Firstpage
495
Abstract
Optoelectronic bonding has been performed onto sample MCMs (multi-chip modules), which are to be used for optical testing for the high-speed optoelectronic memory systems [HOLMS] demonstrator. This was conducted on an FC6 bonder using the flip chip bonding process.
Keywords
CMOS integrated circuits; flip-chip devices; high-speed optical techniques; integrated circuit bonding; integrated optoelectronics; mixed analogue-digital integrated circuits; multichip modules; optical storage; optical testing; photodetectors; surface emitting lasers; BiCMOS SiGe technology; FC6 bonder; MCM; SiGe; VCSEL; flip chip bonding process; high-speed optoelectronic memory systems; mixed signal chip; multichip module; optical testing; optoelectronic bonding; optoelectronic packaging; photodetector; Bonding; Flip chip; Footwear; High speed optical techniques; Optical receivers; Optical sensors; Packaging; Performance evaluation; Testing; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Europe, 2005. CLEO/Europe. 2005 Conference on
Print_ISBN
0-7803-8974-3
Type
conf
DOI
10.1109/CLEOE.2005.1568273
Filename
1568273
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