• DocumentCode
    2902015
  • Title

    Hierarchical test generation for ASIC circuits using macro specification

  • Author

    Ahmed, Zubair ; Rose, Kenneth

  • Author_Institution
    Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    1990
  • fDate
    17-21 Sep 1990
  • Abstract
    Increasingly, VLSI or ULSI designs involve the interconnection of complex macros to produce large-scale systems on a chip. The complexity of the macros and the lack of accessibility to the macros in a chip make efficient test methods essential. Existing ATPG programs flatten designs; this discards the testability information at the macro level. The extent to which macro specification can include testability information which will allow efficient generation of test patterns for assemblages of these macros is discussed. A method of constructing a graph model for a gate-level circuit is illustrated. The graph model can be used for test pattern generation. Experimental results on a set of benchmark circuits are presented. They demonstrate that an improvement in ATPG performance is achieved when the graph model is used instead of the flattened gate-level circuit
  • Keywords
    VLSI; application specific integrated circuits; digital integrated circuits; integrated circuit testing; ASIC circuits; ATPG performance; ATPG programs; ULSI; VLSI; automatic test pattern generation; digital IC; gate-level circuit; generation of test patterns; graph model; hierarchical test generation; interconnection of complex macros; large scale systems on chip; macro specification; test methods; test pattern generation; testability information; Application specific integrated circuits; Assembly; Automatic test pattern generation; Benchmark testing; Circuit testing; Integrated circuit interconnections; Large-scale systems; Test pattern generators; Ultra large scale integration; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC Seminar and Exhibit, 1990. Proceedings., Third Annual IEEE
  • Conference_Location
    Rochester, NY
  • Type

    conf

  • DOI
    10.1109/ASIC.1990.186151
  • Filename
    186151