Title :
Reliability of ambipolar switching poly-Si diodes for cross-point memory applications
Author :
Lee, M.H. ; Kao, C.-Y. ; Yang, C.-L. ; Chen, Y.S. ; Lee, H.Y. ; Chen, F. ; Tsai, M.J.
Author_Institution :
Inst. of Electro-Opt. Sci. & Technol., Nat. Taiwan Normal Univ., Taipei, Taiwan
Abstract :
The ambipolar switching diodes with poly-Si n/p/n were successfully demonstrated for cross-point memory applications, such as RRAM. The high JON ~ 0.1 MA/cm2 was obtained to provide memory programming for area = 2.25 x 10-8 cm2. Both negative and positive biases made the positive shift of the J-V curve with DC stress 100 sec and were contributed by acceptor-like defect formation. However, the reliability is sufficient for >;106 cycles of 100 ns operation (~0.1 s total stress at 4V). VBD of 2.25 x 10-8 cm was estimated >; 1V for 10 years. Finally, the authors are very grateful for the support and funding provided by the National Science Council (NSC 98-2221-E-003-020-MY3), for carrying out the process by National Nano Device Laboratories (NDL).
Keywords :
elemental semiconductors; random-access storage; semiconductor device reliability; semiconductor diodes; silicon; NSC 98-2221-E-003-020-MY3; National Nano Device Laboratories; National Science Council; RRAM; Si; acceptor-like defect formation; ambipolar switching poly-Si diodes; cross-point memory applications; memory programming; negative bias; poly-Si n/p/n; positive bias; positive shift; time 100 ns; time 100 s; voltage 4 V; Bidirectional control; Grain boundaries; Metals; Programming; Reliability; Stress; Switches;
Conference_Titel :
Device Research Conference (DRC), 2011 69th Annual
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-61284-243-1
Electronic_ISBN :
1548-3770
DOI :
10.1109/DRC.2011.5994428