Title :
[Copyright notice]
Abstract :
The following topics are dealt with: advanced packaging and system packaging; high density substrate and SMT; packaging design and modeling; packaging materials and processes; advanced manufacturing technology; quality and reliability.
Keywords :
manufacturing processes; packaging; quality control; reliability; semiconductor process modelling; substrates; surface mount technology; SMT; advanced manufacturing technology; advanced packaging; high density substrate; packaging design; packaging materials; packaging modeling; packaging processes; quality; reliability; system packaging;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1391-1
DOI :
10.1109/ICEPT.2007.4441372
