Title :
New Sensor Packaging Concept for Avionic Application
Author :
Aschenbrenner, R. ; Jung, E. ; Braun, T. ; Oestermann, U. ; Bauer, J. ; Becker, K.-F. ; Reichl, H.
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin
Abstract :
A new packaging technology for a micro-electro-mechanical system (MEMS) pressure sensor was developed to allow the integration of the sensor in a probe mounted on the outside of the airplane. Thus this packaging concept will increase the reliability of equipment by avoiding extra pneumatic connections. Intrinsic advantages of this approach are the avoidance of pressure leaks and the elimination of bad pneumatic connection risk during installation or maintenance phases.
Keywords :
aerospace safety; aircraft maintenance; avionics; electronics packaging; microsensors; pressure sensors; reliability; avionic application; equipment reliability; installation phase; maintenance phase; microelectro-mechanical system pressure sensor packaging; pneumatic connection risk elimination; pressure leakage avoidance; Aerospace electronics; Assembly; Biomembranes; Ducts; Packaging machines; Probes; Sensor systems; Space technology; Spirals; Temperature sensors;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441384
