• DocumentCode
    2902922
  • Title

    Summary Report: Wafer Level Reliability Testing Discussion Group

  • Author

    Boyko, Kenneth C. ; Miller, James W.

  • Author_Institution
    AT&T Bell Laboratories
  • fYear
    1992
  • fDate
    25-28 Oct. 1992
  • Firstpage
    223
  • Lastpage
    228
  • Keywords
    Degradation; Failure analysis; Gain measurement; Human computer interaction; Impedance; Life estimation; Manufacturing processes; Packaging; Testing; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Type

    conf

  • DOI
    10.1109/IWLR.1992.658008
  • Filename
    658008
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2902922