DocumentCode :
2902922
Title :
Summary Report: Wafer Level Reliability Testing Discussion Group
Author :
Boyko, Kenneth C. ; Miller, James W.
Author_Institution :
AT&T Bell Laboratories
fYear :
1992
fDate :
25-28 Oct. 1992
Firstpage :
223
Lastpage :
228
Keywords :
Degradation; Failure analysis; Gain measurement; Human computer interaction; Impedance; Life estimation; Manufacturing processes; Packaging; Testing; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Level Reliability Workshop, 1992. Final Report., 1992 International
Conference_Location :
Lake Tahoe, CA, USA
Type :
conf
DOI :
10.1109/IWLR.1992.658008
Filename :
658008
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2902922
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