Title :
High temperature brazing of porous tungsten with nano structured Mo-Ni for a dispenser cathode application
Author :
Busbaher, Daniel ; Liu, Wen ; Mocher, David ; Sekulic, Dusan P.
Author_Institution :
Semicon Assoc., Lexington, KY, USA
Abstract :
This paper offers an insight into a comprehensive study of liquid nano-composite braze filler spreading during bonding of porous tungsten to molybdenum. The considered application involves structural elements of a dispenser cathode. A new formulation of Mo-Ni filler doped with SiC nano-particles has been analyzed. The study involves a high temperature brazing in controlled atmosphere (N2+H2). The performed studies include DSC/TG analysis of nano-composites, SEM and EDS analyses of the re-solidified filler, the hot stage microscopy tests in real time and in situ, and microprobe studies of the liquid metal penetration into the tungsten porous matrix.
Keywords :
brazing; cathodes; differential scanning calorimetry; liquid metals; molybdenum; nanocomposites; nanoparticles; nickel; particle reinforced composites; porous materials; scanning electron microscopy; silicon compounds; tungsten; DSC/TG analysis; EDS analysis; Mo-Ni-SiC-W; SEM analysis; SiC nanoparticle; dispenser cathode application; high temperature brazing; hot stage microscopy test; liquid metal penetration; liquid nano-composite braze filler; microprobe study; molybdenum; nanocomposite; nanostructured Mo-Ni; porous tungsten; tungsten porous matrix; Assembly; Cathodes; Electronic mail; Filler metals; Silicon carbide; Tungsten; USA Councils; brazing; dispenser cathode; filler metal; nano-composite; tungsten;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2011 IEEE International
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-8662-5
DOI :
10.1109/IVEC.2011.5747006
