Title :
Multilayer Hybrid Circuit Technology
Author :
Flick, Stefan ; Luo, Qingsheng ; Klein, Randy
Author_Institution :
Heraeus TFD, Hanau
Abstract :
The technology that multilayer hybrid circuits use dielectric layer to insulate stacked conduct has been applied many years, but it is limited by the layers and product yield. This paper introduces a newly dielectric paste of Heraeus, recommend several material systems for multilayer hybrid application. Provide comprehensive data based on experiment in migration stability, laser trimming, adhesion, wire bonding reliability and compatibility. This technology would meet hybrid company demands necessary in multilayer hybrid design, manufacturing process, and product reliability. There is a great benefit for existing thick film technology in both commercial and reliability products application.
Keywords :
adhesion; dielectric materials; hybrid integrated circuits; integrated circuit design; integrated circuit technology; lead bonding; multilayers; reliability; adhesion; bonding compatibility; dielectric Heraeus paste; laser trimming; manufacturing process; migration stability experiments; multilayer hybrid circuit technology; multilayer hybrid design; product reliability; thick film technology; wire bonding reliability; Adhesives; Bonding; Circuit stability; Conducting materials; Dielectric materials; Dielectrics and electrical insulation; Laser stability; Nonhomogeneous media; Optical materials; Wire;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441389
