Characterization and Modelling of Cure Kinetics of A Molding Compound

Author

Qian, C. ; Jansen, K.M.B. ; Ernst, L.J. ; Bohm, C. ; Kessler, A. ; Preu, H. ; Stecher, M.

Author_Institution

Delft Univ. of Technol., Delft

fYear

2007

fDate

14-17 Aug. 2007

Firstpage

1

Lastpage

4

Abstract

Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process. In tins paper, the cure kinetics of a molding compound is described by the Kamal-Sourour equation, including the effect of diffusion limitation, and the corresponding parameters are determined. Furthermore, a preliminary dynamic mechanical experiment during cure is presented to show an application of our cure kinetic model.

Keywords

curing; diffusion; integrated circuit packaging; moulding; viscoelasticity; IC packaging; Kamal-Sourour equation; cure kinetic model; diffusion effect; dynamic mechanical experiment; molding compounds; viscoelastic properties; Equations; Fluid flow measurement; Heating; Integrated circuit packaging; Isothermal processes; Kinetic theory; Stress; Temperature distribution; Testing; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1392-8

Electronic_ISBN

978-1-4244-1392-8

Type

conf

DOI

10.1109/ICEPT.2007.4441400

Filename

4441400