Title :
Fracture Simulation of Solder Joints by a Lattice Model
Author :
An, Tong ; Qin, Fei
Author_Institution :
Beijing Univ. of Technol., Beijing
Abstract :
Solder joints serve as mechanical, thermal and electrical interconnections between the electronic packages and the printed circuit board (PCB). Fracture of the solder joint is the most common failure mechanism in microsystem packages due to mechanical loads. In order to satisfy the demand for understanding the process of solder joint fracture, there is a need for a validated model, which is simple, reliable, and able to clarify of physics-of-failure of solder joint for design improvement. In this paper, the lattice model has been established to simulate the process of solder joint fracturing. The results show that the proposed lattice model can easily be used to predict the cracking of solder joint under tensile loading. The predicted crack pattern agrees well with that observed in experiments.
Keywords :
cracks; failure analysis; fracture mechanics; integrated circuit design; integrated circuit packaging; integrated circuit reliability; interconnections; lattice theory; solders; tensile testing; crack pattern; electrical interconnections; electronic packages; failure mechanism; fracture simulation; lattice model; mechanical interconnections; mechanical loads; microsystem packages; printed circuit board; solder joint cracking; solder joint fracture; solder joints; tensile loading; thermal interconnections; Building materials; Concrete; Deformable models; Electronic packaging thermal management; Integrated circuit interconnections; Lattices; Mechanical engineering; Soldering; Structural beams; Thermal engineering;
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
DOI :
10.1109/ICEPT.2007.4441406
